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Samsung is preparing "SAINT" technology for the next generation of HBM4 memory

Samsung plans to launch the latest 3D packaging technology "SAINT" next year, targeting the production of next-generation HBM4 memory. The Korean giant aims to dominate the artificial intelligence industry with new cutting-edge offerings. 3D packaging is expected to be ready by 2025, ahead of the debut of the HBM4 standard in 2026.

Editorial Moonsoo Kang Main2 1000x529

Samsung's 3D packaging technology is the successor to the 2.5D method. Instead of using a silicon interposer to connect the HBM and GPU, the company focused on vertical integration by stacking chiplets on top of each other. This platform is called SAINT (Samsung Advanced Interconnect Technology) and is divided into three types: SAINT-S, SAINT-L and SAINT-D. Each of them works with different types of chips such as SRAM, logic and DRAM.

Vertical packaging provides several advantages over traditional methods. By reducing the distance between chiplets, it speeds up data transfer. Vertical packaging also reduces the carbon footprint, which is an additional advantage for widespread adoption of this technology.

The technology was presented at the Samsung Foundry Forum 2024 in San Jose, California. This is the first public unveiling of the technology, coinciding with NVIDIA and AMD's announcements of their next-generation AI hardware. 3D packaging is expected to be used with HBM4, and will debut alongside NVIDIA's Rubin architecture and AMD's Instinct MI400 accelerators.

Samsung also plans to release "all-in-one heterogeneous integration" technology by 2027. This technology will create a single AI package without the need for separate packaging methods. Following Apple and Intel, which have adopted a SOC-centric approach for their designs such as Lunar Lake processors, AMD is also actively pursuing vertical packaging with unique HBM, MCD and 3D V-Cache stacks. It will be interesting to see where Samsung stands in the future as the company clearly intends to play a dominant role.