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AMD Strix Point "Ryzen AI 9 365" Testing: IPC, Latency and Zen 5 Performance

Lead analyst David Huang tested the AMD Strix Point "Ryzen AI 9 365" APU, providing detailed analysis of IPC, latency and performance. Note that testing was carried out on an engineering sample with unofficial system software.

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David Huang tested an early sample laptop with the Ryzen AI 9 365 using 5GB of LPDDR7500x-32 memory. The focus was on IPC and throughput as measured by the InstructionRate tool, which evaluated the performance of three generations of Zen architectures: Zen 3, Zen 4 and Zen 5.

Zen 5 showed significant improvements thanks to the new architecture. The throughput of various ALU instructions has been significantly increased, but the number of vector units in the mobile version of Zen 5 is halved compared to the desktop and server versions. Branch processing has also been improved, and the latency of SSE/AVX/AVX512 operations has been increased to 2 cycles.

In SPEC CPU 2017 and Geekbench 6 tests, the Ryzen AI 9 365 showed a performance increase of 9,71% compared to Zen 4 and 22,28% compared to Zen 3. In Geekbench 6 single-core tests, the increase reached 40,94% compared to with Zen 3 and 13,1% compared to Zen 4.

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Delivery of laptops from America: Fast, Reliable and Profitable

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Why should you buy laptops from America?

The world of modern technology is developing rapidly, and for many users it is important to have access to the most advanced and high-quality devices. Laptops from America have long won the trust of consumers due to their reliability, high performance and innovative solutions. Buying laptops in the US is becoming increasingly popular, especially given the range of benefits offered by intermediary companies.

Advantages of buying laptops through intermediaries

Buying laptops from America through intermediaries offers a number of advantages that make this process not only simple, but also profitable.

Reliability and Trust

By choosing an intermediary with many years of experience and a large number of users, you can be confident in the reliability and quality of the services provided. Such companies have established themselves as responsible partners who take on all the hassles associated with the purchase and delivery of goods from the USA. Millions of products delivered indicate a high level of customer trust.

Convenience and Simplicity

The process of purchasing and delivering laptops from America becomes as convenient as possible thanks to the professionalism and experience of intermediaries. You don't need to fill out complicated declarations or worry about customs clearance - everyone will do it for you. Some companies offer services for separating parcels into amounts up to 100 euros, which avoids additional costs for customs duties.

Warranty and Insurance

One of the key advantages is the guarantee of the lowest price for delivery services and insurance of goods against loss and damage. This is especially important when purchasing expensive devices such as laptops. Delivery can be made by air from $5,95 per kilogram or by fast sea from $3,95 per kilogram, making the process not only reliable, but also cost-effective. In case of delivery delays, many intermediaries pay compensation, emphasizing their responsibility to customers.

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Support and Consultation

Professional advice and customer support is another compelling argument in favor of choosing intermediaries. Specialists are ready to help you choose the best product at the best price, provide consulting support and help with choosing sizes. In addition, many companies offer virtual address and mail forwarding services, which makes the shopping process even more convenient.

Savings and Benefits

By buying laptops from America through intermediaries, you can save a lot. Intermediaries offer flexible rates for large orders and wholesale customers, which makes purchases even more profitable. Saving up to 70% on quality goods from the USA and Europe is a reality offered by professional companies.

Protection and Guarantees

Fraud protection and multi-step verification of stores and sellers ensure the safety of your purchases. Intermediaries offer product insurance against loss and damage, which ensures the safety of your purchases.

Take advantage of all the benefits of purchasing laptops from America through reliable resellers and enjoy high-quality devices at competitive prices! Find out more about purchasing options laptops from america and take advantage of all the benefits that professional companies offer.

Conclusion

Buying laptops from America through reliable intermediaries provides many advantages, ranging from savings and convenience to guarantee and protection of your purchases. Don't miss out on the opportunity to take advantage of these benefits and enjoy quality, reliable devices shipped straight from the USA.

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Sparkle Unveils New Intel Arc GPU Concepts

Sparkle is expanding its Intel Arc GPU family with new BTF, AIO, Hybrid and Hydro designs, as well as white PCB models. These innovative concepts will be used in the next generation of Battlemage graphics cards.

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Sparkle, one of Intel's leading partners, continues to impress with its unique designs. At Computex 2024, the company revealed several new designs for the Intel Arc A770, including a BTF (Back To Future) model that uses a dedicated high-power interface on the PCB to connect directly to the motherboard, making cable management easier.

Additionally, Sparkle showcased three liquid cooling options for the A770: an AIO with a 240mm radiator, a hybrid air/liquid cooled model, and a Hydro solution from Bitspower. These high-end solutions are aimed at enthusiasts.

Also in development is a new model with a white PCB for the Intel Arc A770, which will be more expensive than the standard black version, but ideal for lovers of white PCs.

Sparkle is also preparing a concept model with a blower for the Arc A770 with a dual-slot design. These concepts are for the next generation of Arc Battlemage graphics cards, expected to release later this year.

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The Future of NVIDIA DLSS: AI will create textures and objects

Future versions of NVIDIA DLSS will be able to use AI to generate textures and objects, which could be a significant change in the gaming industry. In an interview with Moore Than Moore, NVIDIA CEO Jensen Huang shared his thoughts on the future of DLSS technologies.

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Currently, AI is used for neural graphics, generating pixels based on multiple input pixels (Super Resolution) and creating frames (Frame Generation). In the future, AI will be able to create textures and objects that, even if the quality is low, will be improved by AI. Moreover, AI will be able to generate characters in games, creating, for example, among six characters, two real ones and other long-term AI ones. Ultimately, AI will become the dominant technology, and NVIDIA is committed to making it available to a wide range of users.

According to Huang, games will be created using AI, there will be AI inside them, and even the PC will become an AI assistant using G-Assist. Users will be able to use their PC as an AI assistant for games. GeForce, the largest gaming brand in the world, continues to grow, and many of its products already include AI in one form or another.

While Huang didn't specify whether these features will be included in NVIDIA DLSS 4, it will be interesting to see what the new version of the technology will offer in addition to Super Resolution, Frame Generation and Ray Reconstruction introduced in previous versions. With the launch of the next generation of GPUs later this year, it may not be long before we see how AI will continue to impact the gaming world.

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Samsung is preparing new SSDs: 990 EVO Plus and 9100 PRO with Gen5

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Samsung has filed trademark applications for its upcoming SSDs: 990 EVO Plus and 9100 PRO. It is expected that these will be devices of the new generation Gen5.

Over the past year, Gen5 SSDs have achieved significant speeds exceeding 14.5 GB/s. However, Samsung, known for its storage innovations, has not yet released any new consumer models. The latest SSD to be introduced, the 990 PRO, is one of the fastest Gen4-based SSDs, delivering speeds of up to 7450 MB/s and featuring RGB lighting.

According to Sammobile, the new trademarks have been registered with KIPRIS (Korea Intellectual Property Rights Information Service). There's no official word yet from Samsung about the specifications of the new SSDs, but the 990 EVO Plus is likely to be a more affordable solution similar to the 990 PRO but without DRAM. At the same time, the 9100 PRO could be the first Gen5 model for consumers.

Samsung will use its own Gen5 SSD controller, while most manufacturers use the Phison E26 controller. Gen5 SSDs offer double the read and write speeds of Gen4, but do not yet provide significant benefits in real-world use, and also require powerful cooling systems.

We expect Samsung's new Gen5 SSDs to be worth the money and meet consumer expectations.

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Intel Fixes Instability Issue on 13th and 14th Gen Processors with New Firmware

Intel has confirmed that the cause of problems with instability of 13th and 14th generation processors is a bug in the eTVB (Enhanced Thermal Velocity Boost) microcode, as well as increased input voltages. The company has already started rolling out a BIOS update that fixes the eTVB firmware to address instability issues.

According to Intel, a bug in the eTVB microcode causes processor instability, but this is not the only reason. Higher input voltages resulting in higher turbo boost frequencies and voltages also contribute to problems. Intel and its partners, such as motherboard manufacturers, have already begun rolling out the new BIOS with the eTVB microcode fix.

As of now, manufacturers like MSI have already released BIOS updates for their Z790 boards. New BIOS versions use microcode B0671/125, which fixes the eTVB bug.

Among the updated models are:

  • MPG Z790 CARBON WIFI – 7D89v1C3
  • MPG Z790 CARBON WIFI II - 7D89vA43
  • MPG Z790 CARBON MAX WIFI - 7D89vA43
  • Z790MPOWER - 7E01vP33

Intel has also released a guide for configuring "Intel Default Settings" power profiles to ensure stability for all Core i9, i7 and i5 processors. This means that reduced power will be applied to ensure stability, which may result in reduced performance.

Intel Default Settings

The problem was identified through instability analysis, which indicated that the cause was an incorrect value in the eTVB microcode algorithm. Intel has confirmed that the new patch fixes the bug, but it does not solve all instability problems.

The company also encourages users to update their motherboard BIOS to the new firmware version by July 19, 2024. This update includes a fix for eTVB that should improve the processor experience.

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NVIDIA became the most valuable company in the world, reaching a market value of $3.336 trillion

Today, June 18, NVIDIA reached a market value of $3.336 trillion, becoming the most valuable company in the world. Despite recent gains in Microsoft and Apple stock prices, NVIDIA shares are up 3.57% at the time of writing, while other stocks are down slightly.

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NVIDIA is rapidly increasing its market value, crossing the $1 trillion mark last year and reaching $3.28 trillion today. Earlier this month, NVIDIA announced a 10-fold stock split, making the stock more accessible to smaller investors. The move likely contributed to the company's recent surge in shares, which has led to an overall gain of 170% so far this year.

NVIDIA's growth was driven by strong demand for its AI accelerators. The company has seen several wild share gains over the past decade, driven by demand for cryptocurrency mining hardware and a significant increase in gaming GPU sales during the COVID-19 pandemic.

Looking ahead, NVIDIA is gearing up to launch its Blackwell GPU architecture for data centers and is expected to unveil the gamer-focused RTX 50 series by the end of the year.

This phenomenal growth makes NVIDIA a key player in the technology market and underscores its importance in the industry. Investors and analysts expect the company to continue its successful projects and strengthen its position in the market.

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TSMC will raise prices for 3nm chips and packaging amid strong demand

TSMC is preparing to increase prices for its advanced 3nm semiconductor products. Prices for 3nm chips will rise by 5% and prices for advanced packaging will rise by 10-20% next year, according to a new China Times report.

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TSMC occupies a leading position in the contract chip manufacturing industry, and the bulk of orders from large technology companies are sent to them. TSMC's well-known clients include Apple and NVIDIA. Recent rumors from Taiwan indicate high demand for 3nm products, leading to the need to increase capacity.

Earlier this month there were reports of a possible price increase, but new information provides more specific details. Sources said TSMC will increase its packaging capacity to 33,000 wafers per month by the third quarter of this year, nearly double the current capacity of 17,000 wafers.

About half of this power will be used for NVIDIA products, with AMD coming in second. Unlike smartphone processors ordered by Apple and Qualcomm, AI GPUs and accelerators from AMD and NVIDIA are more dependent on advanced packaging because they consume more power and require high performance.

Demand for 3nm products is expected to increase in the second half of this year. It is rumored that their production capacity will not be fully utilized until 2025-2026, and a similar situation is predicted for advanced packaging products.

NVIDIA plays a key role in the global transition to accelerated computing. The company's shares have posted triple-digit percentage gains over the past year as analysts and investors expect it to play a major role in the process. NVIDIA's AI chips are in high demand among major companies such as Microsoft, Meta and Tesla, which are competing for the latest GPUs to train their AI products.

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Samsung is preparing "SAINT" technology for the next generation of HBM4 memory

Samsung plans to launch the latest 3D packaging technology "SAINT" next year, targeting the production of next-generation HBM4 memory. The Korean giant aims to dominate the artificial intelligence industry with new cutting-edge offerings. 3D packaging is expected to be ready by 2025, ahead of the debut of the HBM4 standard in 2026.

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Samsung's 3D packaging technology is the successor to the 2.5D method. Instead of using a silicon interposer to connect the HBM and GPU, the company focused on vertical integration by stacking chiplets on top of each other. This platform is called SAINT (Samsung Advanced Interconnect Technology) and is divided into three types: SAINT-S, SAINT-L and SAINT-D. Each of them works with different types of chips such as SRAM, logic and DRAM.

Vertical packaging provides several advantages over traditional methods. By reducing the distance between chiplets, it speeds up data transfer. Vertical packaging also reduces the carbon footprint, which is an additional advantage for widespread adoption of this technology.

The technology was presented at the Samsung Foundry Forum 2024 in San Jose, California. This is the first public unveiling of the technology, coinciding with NVIDIA and AMD's announcements of their next-generation AI hardware. 3D packaging is expected to be used with HBM4, and will debut alongside NVIDIA's Rubin architecture and AMD's Instinct MI400 accelerators.

Samsung also plans to release "all-in-one heterogeneous integration" technology by 2027. This technology will create a single AI package without the need for separate packaging methods. Following Apple and Intel, which have adopted a SOC-centric approach for their designs such as Lunar Lake processors, AMD is also actively pursuing vertical packaging with unique HBM, MCD and 3D V-Cache stacks. It will be interesting to see where Samsung stands in the future as the company clearly intends to play a dominant role.

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Prices for new AMD Ryzen 9000 processors appear online ahead of July launch

AMD's next-gen Ryzen 9000 desktop processors based on the Zen 5 architecture have started appearing in online store listings ahead of their official launch in July. At Computex 2024, AMD unveiled its Ryzen 9000 processor lineup along with X870E/X870 motherboards. The new processors are supported on existing and future AM5 motherboards and promise significant performance improvements, including a 16% increase in IPC (instructions per clock).

The new AMD Ryzen 9000 models include the Ryzen 9 9950X, Ryzen 9 9900X, Ryzen 7 9700X and Ryzen 5 9600X processors, with the same numbers of cores as their predecessors: 16, 12, 8 and 6, respectively. Retailers around the world have begun to include these processors in their catalogs, and preliminary prices appear to be similar to or lower than Zen 4 chips.

AMD Ryzen 9 9950X CPU Price

According to Canada Computers, the Ryzen 9 9950X costs CAD 839.00, which is lower than the Ryzen 939.00 9X's CAD 7950 at launch. CAD 839.00 translates to $610 US, which is $90 lower than the MSRP of the Ryzen 9 7950X, which cost $699 at launch.

  • Ryzen 9 9950X - CAD 839.00 ($610 US)

Previous rumors indicated that Ryzen 9000 processors would be priced similarly to the Ryzen 7000, and current early listings support that speculation for the 9900X, 9700X, and 9600X. However, the flagship 9950X could cost significantly less, although this is still speculation.

AMD has officially confirmed that Ryzen 9000 processors will go on sale in July. Some retailers like B&H say pre-orders will begin on July 31st at 9am (ET). We expect to publish reviews of AMD Ryzen 9000 processors in the coming month.

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