Intel to continue glass substrate development as planned, dismissing rumors of tech transfer to Samsung

Company Intel denied rumors that the work was being stopped or that glass substrate technology was being transferred to other manufacturers. Company representatives confirmed that development was continuing in full compliance with roadmap presented in 2023, and there were no changes in strategic direction.

Glass substrates represent a promising alternative to traditional organic materials in microcircuit packaging. Their key advantages are high strength, durability and density of connections, provided by a thinner glass layer. Such characteristics are especially important in the context of increasing complexity and miniaturization of components. Despite the temporary slowdown in progress, Intel remains one of the leaders in glass substrate R&D.

Recent reports of Intel employees moving to Samsung Electro-Mechanics have raised suspicions of possible transfer of technology or abandonment of the project. However, a commentary published via South Korean publication ETNews emphasized that Intel is not in talks to license glass substrates and continues to develop its own capacities.

For Intel, this area is of critical importance: Glass substrates will form the basis of future packaging solutions, especially in the era of chiplets and heterogeneous integration. In the face of financial instability, the company is betting on long-term innovation, and maintaining its focus on glass substrate development confirms its commitment to remaining at the forefront of the semiconductor industry.